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ENGINEERED ALUMINA /S ILICON CARBIDE LAMINATED COMPOSITES Francesca De Genua E-mail: [email protected] Approved by: Prof. V.M. Sglavo, Advisor Department of Industrial Engineering University of Trento, Italy. Ph.D
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i TABLE OF CONTENTS LIST OF TABLES iii LIST OF FIGURES iv ABSTRACT vi CHAPTER 1 1 1.1 Introduction 1 1.2 An Overview of Silicon Carbide 1 1.3 Hard Coatings 4 1.4 Thin Films for MEMS Devices 5 1.5 Thin Film Deposition 5 1.5.1
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Silicon Carbide 2450 (decomposes) Boron Carbide 2425 (decomposes) Aluminum Nitride 2300 (decomposes) Alumina 2050 Silicon Nitride 1870 (decomposes) ELASTIC MODULUS The elastic modulus or Young’s modulus is a proportionality constant
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Young''s Modulus 100.02 .. 220.02 GPa Ceramic,reaction sintered ,at temp=20 C CRC Materials Science and Engineering Handbook, p.509 Young''s Modulus 175.03 .. 250 GPa Ceramic,hot pressed ,at temp=1400 C CRC Materials Science and Engineering
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Materials such as alumina, silicon car-bide, titanium carbide, silicon nitride, and a crystallized glass ceramic have been investigated. Y Young''s modulus of elasticity, N/m2(psi) Z depth to maximum shear stress, m(in.) 8 Poisson''s ratio maximum shear a,b
Elasticity | DEV SICT
Young''s modulus (GPa) Hardness (Vickers -GPa) Fracture toughness K(Ic) Alumina (94 to 99.8 % ) 3.6 to 3.9 1700 to 2500 250 to 350 350-370 12 to 18 4 to 5 Alumina-zirconia composites 4.0 2000 450 350 14 5 to 6 Zirconia MgO 5.5 >1700 550 to 700 170 to
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Young''s Modulus Gpa 280 350 205 295 670 65 Vickers Hardness Gpa 14 20 12 18-20--Flexural Strength Mpa 280 300 900 650 51 100 Compressive Strength Mpa 2000 2500 2200 2200 230 500 Thermal Conductivity W/(m•K) 18-25 30 2.2 25 20 1.70 ΔT(C ) 220
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Effect of a High Density of Stacking Faults on the Young’s Modulus of GaAs Nanowires. Nano Letters 2016, 16 (3) , 1911-1916. DOI: 10.1021/acs.nanolett.5b05095. Lunjie Zeng, …
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Strength in Silicon Carbide Whisker /alumina Composites Increase in strength in silicon carbide whisker/alumina composites as a function of the whisker volume fraction and test temperature. (After G. C. Wei and P. F. Becher, Am. Ceram. Soc. Bull ., 64 (1985
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Silicon carbide (SiC) features hardness second only to diamond and boron carbide and possesses high wear resistance, thus it''s used for sliding parts (mechanical seals, etc.). In addition, it enjoys a high Young modulus and a small coefficient of thermal expansion, thus it''s used for components (optical parts, substrates, etc.) that require high precision. Because it is a dense sintered body
Metal Matrix Si-SiC - Advanced Ceramics
Young’s modulus (Gpa) 330 280 Young’s modulus / density (Gpa ⋅ cm 3 /g) 110 100 Flexural strength (MPa) 300 300 Coefficient of thermal expansion (1/ C×10-6) 3 3 Thermal conductivity (W/m×K) 190 175
IOP Conference Series: Materials Science and Engineering PAPER OPEN ACCESS Related content Mechanical Behaviour of Alumina Silicon Carbide
IOP Conference Series: Materials Science and Engineering PAPER OPEN ACCESS Mechanical Behaviour of Alumina Silicon Carbide Reinforced Particulate Reinforced Metal Matrix Composite To cite this article: K.S. Raghu Ram et al 2017 IOP Conf. Ser.: Mater.
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Processing and Characterization of Alumina / Chromium Carbide Ceramic Nanocomposite 149 mechanism and grain boundary strengthening mechanism. The c-mechanism is based on the fact that the matrix becomes refined followi ng the adding of nano-sized
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In general, the Young''s modulus variation of all the composition studied shows a similar trend with increasing sintering temperature. A general observation that can be made from Fig. 3 is that the dopant has a positive effect on the Young''s modulus of alumina
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carbide, or diamond particles in high strength reinforced a-alumina matrix composites even though diamond has a much higher Young''s modulus. For particulate reinforced ceramic matrix composites, a lower thermal expansion
Metal Matrix Al-SiC - Advanced Ceramics
Young’s modulus (Gpa) 115 125 150 Young’s modulus / density (Gpa ⋅ cm 3 /g) 41 45 52 Flexural strength (MPa) – – – Coefficient of thermal expansion (1/ C×10-6) 15 14 13 Thermal conductivity (W/m×K) 145 150 155
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Silicon-infiltrated Silicon Carbide (SiSiC) Proprietary joining and manufacturing technology coined with our excellent StarCeram Young’s modulus RT [GPa] 395 380 Thermal conductivity RT [W/mK] 125 200 CTE (RT -1,000C ) [x10-6 K-1] 4.5 4.0 Resistivity
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